Synthesis and characterization of novel high temperature structural adhesives based on nadic end capped MDA-BTDA-ODA copolyimide

Abstract

A series of novel copolyimide structural adhesives were synthesized using 4,4′-diaminodiphenylmethane (MDA), 3,4′-oxydianiline (ODA) and 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride (BTDA) as co-monomers, and nadic anhydride as an end cap reagent. The adhesives with different MDA and ODA contents were examined in terms of their structure, thermal stability, mechanical properties, and adhesive performance. They have glass transition temperatures (T g) about 400 °C, with thermal stability up to 500 °C. The effect of diamine monomer compositions on adhesion performance and processability of the copolyimides were studied. The copolyimides exhibited adhesion strength up to 16.3 MPa at room temperature. Nadic end capped MDA-BTDA-ODA copolyimide resins gained adjustable and controllable processability with the addition of ether bridged aromatic segments. The copolyimide adhesive with equimolar composition of MDA:ODA is distinguished form the both commercial PMR-15 and LARC RP-46 polyimides in terms of its better processability and mechanical performance.