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https://hdl.handle.net/11147/6787
Title: | Investigation of long waviness induced by the wire saw process | Authors: | Teomete, Egemen | Keywords: | Surface waviness Wire saw Process design Ceramic |
Publisher: | SAGE Publications Inc. | Source: | Teomete, E. (2011). Investigation of long waviness induced by the wire saw process. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 225(7), 1153-1162. doi:10.1177/2041297510393620 | Abstract: | In the photovoltaic and semiconductor industries silicon wafers are sliced using the wire saw process. This process is also used to machine almost all kinds of brittle materials where high yield and low surface damage is desired. The wire saw process induces roughness and long waviness on the cut surface. These defects have to be removed by post-process techniques including grinding and lapping, which increases costs. The present study investigated the long waviness induced by the wire saw process. An analytical model for long waviness generation has been developed. Experimental work was conducted with different process parameters. The analytical model is capable of explaining the long waviness generation observed in experimental work. Process design recommendations with minimal waviness and high efficiency are presented. | URI: | http://doi.org/10.1177/2041297510393620 http://hdl.handle.net/11147/6787 |
ISSN: | 0954-4054 |
Appears in Collections: | Civil Engineering / İnşaat Mühendisliği Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection |
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