Please use this identifier to cite or link to this item: https://hdl.handle.net/11147/6787
Title: Investigation of long waviness induced by the wire saw process
Authors: Teomete, Egemen
Teomete, Egemen
Izmir Institute of Technology. Civil Engineering
Keywords: Surface waviness
Wire saw
Process design
Ceramic
Issue Date: Jul-2011
Publisher: SAGE Publications Inc.
Source: Teomete, E. (2011). Investigation of long waviness induced by the wire saw process. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 225(7), 1153-1162. doi:10.1177/2041297510393620
Abstract: In the photovoltaic and semiconductor industries silicon wafers are sliced using the wire saw process. This process is also used to machine almost all kinds of brittle materials where high yield and low surface damage is desired. The wire saw process induces roughness and long waviness on the cut surface. These defects have to be removed by post-process techniques including grinding and lapping, which increases costs. The present study investigated the long waviness induced by the wire saw process. An analytical model for long waviness generation has been developed. Experimental work was conducted with different process parameters. The analytical model is capable of explaining the long waviness generation observed in experimental work. Process design recommendations with minimal waviness and high efficiency are presented.
URI: http://doi.org/10.1177/2041297510393620
http://hdl.handle.net/11147/6787
ISSN: 0954-4054
Appears in Collections:Civil Engineering / İnşaat Mühendisliği
Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection
WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection

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