Please use this identifier to cite or link to this item: https://hdl.handle.net/11147/2730
Title: CoCrMo alloy treated by floating potential plasma assisted nitriding and plasma based ion implantation: Influence of the hydrogen content and of the ion energy on the nitrogen incorporation
Authors: Pichon, L.
Okur, Salih
Öztürk, Orhan
Rivière, J. P.
Drouet, M.
Okur, Salih
Öztürk, Orhan
Keywords: Nitrogen plasma
Expanded austenite structure
Plasma based ion implantation
Wear resistance
Molybdenum alloys
Cobalt alloys
Issue Date: Jun-2010
Publisher: Elsevier Ltd.
Source: Pichon, L., Okur, S., Öztürk, O., Rivière, J. P., and Drouet, M. (2010). CoCrMo alloy treated by floating potential plasma assisted nitriding and plasma based ion implantation: Influence of the hydrogen content and of the ion energy on the nitrogen incorporation. Surface and Coatings Technology, 204(18-19), 2913-2918. doi:10.1016/j.surfcoat.2010.01.050
Abstract: Nitriding was performed on a medical grade CoCrMo alloy at 400°C in N2 or N2-H2 atmosphere at a working pressure of 0.84Pa for 2h. Various surface treatment techniques were used to incorporate nitrogen into the CoCrMo alloy: without any plasma assistance, by floating potential radio-frequency plasma assisted nitriding (FPPAN), by plasma based ion implantation (PBII) with several high voltage accelerations (up to 20kV). Without plasma activation, no nitrogen is incorporated in the CoCrMo. On the contrary, all the plasma or PBII treated samples show the formation of a nitrogen-rich f.c.c. γN phase. The layer nitrided over few microns has a nitrogen composition ranging from 30at.% to about 20at.% near the nitrided layer-substrate interface, with an enhanced surface microhardness. Hydrogen is found to enhance the nitriding efficiency. Without hydrogen, a high voltage polarization provides a supplementary amount of implanted nitrogen available for further diffusion and the sputtering of the surface passive oxide. So, with limited high voltages, thicker layers with higher amounts of nitrogen can be achieved by PBII compared to plasma nitriding. However, with higher voltages, the sputtering becomes too important and the nitride layer is thinner. © 2010 Elsevier B.V.
URI: http://doi.org/10.1016/j.surfcoat.2010.01.050
http://hdl.handle.net/11147/2730
ISSN: 0257-8972
Appears in Collections:Physics / Fizik
Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection
WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection

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