Now showing items 11-13 of 13
Investigation of long waviness induced by the wire saw process
(SAGE Publications, 2011-07)
In the photovoltaic and semiconductor industries silicon wafers are sliced using the wire saw process. This process is also used to machine almost all kinds of brittle materials where high yield and low surface damage is ...
Phase II benchmark control problem for seismic response of cable-stayed bridges
This paper presents the problem definition for the second generation of benchmark structural control problems for cable-stayed bridges. The goal of this study is to provide a testbed for the development of strategies for ...
Micromechanical modelling of size effects in microforming
This paper deals with the micromechanical modelling of the size dependent mechanical response of polycrystalline metallic materials at micron scale through a strain gradient crystal plasticity framework. The model is ...